Industries
Semiconductor testing — bond pull, die shear and micro-force
Semiconductor customers test bond wires, die attach and package joints rather than bulk material, so what matters is micro-force accuracy, precise fixturing and traceable reporting. We supply bond pull, die shear and micro-force test systems for that work.
What makes this industry hard
Micro-force mechanical testing for packaging and microelectronics.
The forces are very small
Bond wire and die attach tests are measured in grams-force, so the load cell and the frame stiffness both matter.
Fixturing drives repeatability
Sample clamping and hook geometry decide whether the numbers are comparable across shifts and operators.
Failure mode must be recorded
Packaging engineers need the failure mode and the curve, not just a peak load.
What we provide
What we provide
Semiconductor customers test bond wires, die attach and package joints rather than bulk material, so what matters is micro-force accuracy, precise fixturing and traceable reporting. We supply bond pull, die shear and micro-force test systems for that work.
Bond pull / wire pull
Bond pull testing for wire and ribbon bonds.
Die shear
Die shear and ball shear testing for package joints.
Micro-force test systems
Micro-force benches with precision fixtures and recorded results.
Questions buyers ask
Questions buyers ask
- Do you supply environmental or reliability chambers for semiconductors?
- Not as published products today. Our semiconductor range is mechanical micro-force testing; for environmental or reliability work please ask and we will confirm what we can offer.
- Can you match a customer-specific test method?
- Send the method and the sample format; we will confirm fixture and load-cell configuration before quoting.
Request a quote
Micro-force mechanical testing for packaging and microelectronics.